Selective Soldering Flux

Selective Soldering Fluxes

Superior SSF-NC50 is a VOC-free, No-Clean selective soldering flux. This No-Clean flux promotes the rapid activity necessary for selective soldering. SSF-NC50 is also formulated to withstand the higher temperature requirements of selective soldering applications. SSF-NC50 leaves a clear residue and is effective for both lead-free and lead-bearing solder alloys. SSF-NC50 is classified as an ORL0 per J-STD-004.

Superior SSF-NC400 is an alcohol-based, No-Clean flux designed specifically for selective soldering. SSF-NC400 contains a specialized rosin/resin blend that leaves a clear residue and is effective for both lead-free and lead-bearing solder alloys. This No-Clean flux’s activity level is robust to meet the rapid activity required in selective soldering, leaving a bright solder finish and no visible residue. SSF-NC400 is classified as an ROL1 per J-STD-004.

Superior SSF-WS80 water-soluble, selective soldering flux is a neutral, alcohol-based flux ideally formulated for selective soldering applications. SSF-WS80 provides the activity of a water-soluble flux, but as it is neutral, it should not corrode the stainless steel components of the selective soldering apparatus. SSF-WS80 is classified as an ORM0 per J-STD-004.

Superior SSF-RMA20 is a Type RMA rosin flux formulated for selective soldering applications. SSF-RMA20 has the controlled activity of an RMA flux, but contains the ideal amount of solvents to reduce the clogging of the flux sprayer nozzle typical with rosin-based fluxes. (Note: The clogging of flux spray nozzles with rosin residue can often by cleared up by flushing the flux spray apparatus with Isopropyl Alcohol 99%.) This rosin flux conforms to Mil-F-14256, Type RMA, and ROM1 per J-STD-004

Nozzle Tinning

Superior No. 75 is a conditioning flux specifically formulated for tinning the soldering nozzle on selective soldering machines. Regular and proper tinning of the top and side of the solder nozzle barrel ensures the solder will flow evenly and consistently out of the nozzle. When not regularly tinned, there is an increased likelihood that the solder will begin to flow unevenly, leading to inconsistent or ineffective soldering of the PCB. No. 75 contains Zinc Chloride and Ammonium Chloride.

Superior No. 23, like the No. 75, is a conditioning flux formulated for tinning selective soldering nozzles. Unlike the No. 75, No. 23 does not contain any Ammonium Chloride, a chemical that may be regulated in certain countries.

Learn about Superior Flux’s PCB Assembly Wave Soldering Flux and its full range of Electronics Soldering Flux.