No-Clean Lead-Bearing Soldering Paste
Our 5920-series No-Clean Lead-Bearing Solder Paste is available using Sn63/Pb37 Tin/Lead Alloy. This product is currently available in syringes or jars in Type 3, Type 4 and Type 5 mesh sizes. Contact us if you need additional mesh sizes.
Our 5920-series Lead-Bearing Water Soluble Solder Paste is halide-free, halogen-free yet active enough for a variety of PCBs and environments. The 5920-series solder paste exhibits superior wetting characteristics, lot-to-lot consistency and stable viscosity. The following tables describe the No Clean Lead-Bearing 5920-series solder paste available.
Inquire about our full line of No-Clean Lead-Bearing Solder Pastes. Please note that we can custom blend solder pastes with specific metal contents and viscosity for your particular needs.
No Clean Sn63-Pb37, Type 3
| SOLDER PASTE PRODUCT NUMBER | 592-13-8975 (Jars & Syringes) |
| FLUX TYPE | No Clean |
| SOLDER ALLOY | 63Sn/37Pb |
| ALLOY MESH SIZE | Type 3 |
| METAL CONTENT | 89.75% (Jars, Syringes) |
| SPECIFICATIONS | ROL0 per IPC J-STD 004 |
| REFLOW TEMPERATURE | Liquidus: 221° C/428.8° /F Max: 220° C/428° F |
| SDS | Link |
| SPEC. SHEET | Link |
No Clean Sn63-Pb37, Type 4
| SOLDER PASTE PRODUCT NUMBER | 592-14-8975 (Jars, Syringes) |
| FLUX TYPE | No Clean Lead Bearing |
| SOLDER ALLOY | 63Sn/37Pb |
| ALLOY MESH SIZE | Type 4 |
| METAL CONTENT | 89.75% (Jars, Syringes) |
| SPECS. | ROL0 per IPC J-STD 004 |
| REFLOW TEMPERATURE | Liquidus: 221° C/428.8° /F Max: 220° C/428° F |
| SDS | Coming Soon |
| SPEC. SHEET | Coming Soon |
No Clean Sn63-Pb37, Type 5
| SOLDER PASTE PRODUCT NUMBERS | 592-15-8975 (Jars, Syringes) |
| FLUX TYPE | No Clean Lead Bearing |
| SOLDER ALLOY | 63Sn/37Pb |
| ALLOY MESH SIZE | Type 5 |
| METAL CONTENT | 89.75% Jars, Syringes) |
| SPECS. | ROL0 per IPC J-STD 004 |
| REFLOW TEMPERATURE | Liquidus: 221° C/428.8° /F Max: 220° C/428° F |
| SDS | Coming Soon |
| SPEC. SHEET | Coming Soon |