Low-Temp No-Clean Solder Paste
Our Low-Temperature, No-Clean Solder Paste uses the alloy Sn42/Bi57/Ag1, which exhibits the known low temperature abilities of more traditional tin-bismuth alloys. The addition of silver adds strength to the alloy, all the while mitigating one of the drawbacks to the more traditional tin-bismuth alloys, brittleness, . Our Low-Temperature Solder Paste is currently available in Type 3 and Type 5 alloys, but additional mesh sizes can be provided upon request.
Please note that we can custom blend solder pastes with specific Metal Contents for your particular needs.
Inquire about our full and growing line of solder pastes and tacky fluxes, which can be found in our Electronics Solder Flux category.
No-Clean, Low-Temp, Type 3
| Solder Paste Product Numbers | 59-193-90 (Jars, Cartridges, Squeezers) 59-193-87 (Syringes) |
| Flux Type | No-Clean |
| Solder Alloy | Sn42/Bi57/Ag1 |
| Alloy Mesh Size | Type 3 |
| Metal Content | 90% (Jars, Cartridges, Squeezers) 87% (Syringes) |
| Specifications | REL0 (IPC) |
| Reflow Temperature | Liquidus: 137°C/278°F Max: 165°C/329°F |
| SDS | SDS 59-193-90 (Jars) SDS 59-193-87 (Syringes) |
| TDS | TDS 59-193-90 (Jars) TDS 59-193-87 (Syringes) |
No-Clean, Low-Temp, Type 5
| Solder Paste Product Numbers | 59-195-885 (Jars, Cartridges, Squeezers) 59-195-86 (Syringes) |
| Flux Type | No-Clean |
| Solder Alloy | Sn42/Bi57/Ag1 |
| Alloy Mesh Size | Type 5 |
| Metal Content | 88.5% (Jars, Cartridges, Squeezers) 86% (Syringes) |
| Specifications | REL0 (IPC) |
| Reflow Temperature | Liquidus: 137°C/278°F Max: 165°C/329°F |
| SDS | SDS 59-195-885 (Jars) SDS 59-195-86 (Syringes) |
| TDS | TDS 59-195-885 (Jars) TDS 59-195-86 (Syringes) |
Pleases review our full line of Electronics Soldering Fluxes & Solder Pastes, including fluxes and solder pastes for PCB Assembly, PCB Fabrication, Semiconductor Fabrication and more.