Lead-Free No-Clean Solder Paste
Our 592-series No-Clean solder paste is available in two lead-free solder alloys, SAC305 (Sn96.5/Ag3/Cu0.5) and the Sn96.5/Ag3.5. The SAC305 is currently available in Type 3, Type 4 and Type 5 mesh size; the Sn96.5/Ag3.5 is available in Type 3 mesh size. Contact us if you need additional mesh sizes.
Our 592-series No-Clean Solder Paste is halide-free yet active enough for a variety of PCBs and environments. The 592-series solder pastes exhibit superior wetting abilities, lot-to-lot consistency and stable viscosity. The following tables describe the Lead-Free, No-Clean 592-series solder paste available. Please note the 592-series is also available with Tin-Lead alloys, as well as with a Low-Temp, Tin-Bismuth-Silver alloy.
Inquire about our full line of Water-Soluble, Lead-Free Solder Paste. Please note that we can custom blend solder pastes with specific Metal Contents for your particular needs.
No-Clean, SAC-305, Type 3
| Solder Paste Product Numbers | 592-63-885 (Jars, Cartridges, Squeezers) 592-63-86 (Syringes) |
| Flux Type | No-Clean |
| Solder Alloy | SAC305 |
| Alloy Mesh Size | Type 3 |
| Metal Content | 88.5% (Jars, Cartridges, Squeezers) 86% (Syringes) |
| Specifications | REL0 (IPC) |
| Reflow Temperature | Liquidus: 217°C/423°F Max: 250°C/482°F |
| SDS | SDS 592-63-885 (Jars) SDS 592-63-86 (Syringes) |
| TDS | TDS 592-63-885 (Jars) TDS 592-63-86 (Syringes) |
No-Clean, SAC-305, Type 4
| Solder Paste Product Numbers | 592-64-8825 (Jars, Cartridges, Squeezers) 592-64-86 (Syringes) |
| Flux Type | No-Clean |
| Solder Alloy | SAC305 |
| Alloy Mesh Size | Type 4 |
| Metal Content | 88.25% (Jars, Cartridges, Squeezers) 86% (Syringes) |
| Specifications | REL0 (IPC) |
| Reflow Temperature | Liquidus: 217°C/423°F Max: 250°C/482°F |
| SDS | SDS 592-64-8825 (Jars) SDS 592-64-86 (Syringes) |
| TDS | TDS 592-64-8825 (Jars) TDS 592-64-86 (Syringes) |
No-Clean, SAC-305, Type 5
| Solder Paste Product Numbers | 592-65-88 (Jars, Cartridges, Squeezers) 592-65-86 (Syringes) |
| Flux Type | No-Clean |
| Solder Alloy | SAC305 |
| Alloy Mesh Size | Type 5 |
| Metal Content | 88% (Jars, Cartridges, Squeezers) 86% (Syringes) |
| Specifications | REL0 (IPC) |
| Reflow Temperature | Liquidus: 217°C/423°F Max: 250°C/482°F |
| SDS | SDS 592-65-88 (Jars) SDS 592-65-86 (Syringes) |
| TDS | TDS 592-65-88 (Jars) TDS 592-65-86 (Syringes) |
No-Clean, Sn96.5/Ag3.5, Type 3
| Solder Paste Product Numbers | 592-33-885 (Jars, Cartridges, Squeezers) 592-33-86 (Syringes) |
| Flux Type | No-Clean |
| Solder Alloy | Sn96.5/Ag3.5 |
| Alloy Mesh Size | Type 3 |
| Metal Content | 88.5% (Jars, Cartridges, Squeezers) 86% (Syringes) |
| Specifications | REL0 (IPC) |
| Reflow Temperature | Liquidus: 221°C/430°F Max: 250°C/482°F |
| SDS | SDS 592-33-885 (Jars) SDS 592-33-86 (Syringes) |
| TDS | TDS 592-33-885 (Jars) TDS 592-33-86 (Syringes) |
Pleases review our full line of Electronics Soldering Fluxes & Solder Pastes, including products for PCB Assembly, PCB Fabrication, Semiconductor Fabrication and more.