Lead-Bearing Water Soluble Solder Paste
Our 8800-series Lead-Bearing Water Soluble Solder Paste is available with the Sn63/Pb37 Tin/Lead Alloy. This product is currently available in Type 3, Type 4 and Type 5 mesh sizes. The solder paste can be packaged as ready to use squeezers, syringes, jars, or cartridges. Contact us if you need additional mesh sizes.
Our 8800-series Solder Pastes are halide-free yet active enough for a variety of PCBs and environments. The 8800-series solder paste exhibits superior wetting characteristics, lot-to-lot consistency and stable viscosity. The following tables describe the Lead-Bearing Water Soluble 8800-series solder paste available.
Inquire about our full line of Lead-Bearing Water Soluble Solder Pastes. Please note that we can custom blend solder pastes with specific metal contents and viscosity for your particular needs.
Water Soluble Sn63-Pb37, Type 3
SOLDER PASTE PRODUCT NUMBERS | 88-13-8975 (Jars, Cartridges, Squeezers) |
FLUX TYPE | Water Soluble, Rosin-based |
SOLDER ALLOY | 63Sn/37Pb |
ALLOY MESH SIZE | Type 3 |
METAL CONTENT | 89.75% (Jars, Cartridges, Squeezers) |
SPECS. | ROL0 per IPC J-STD 004 |
REFLOW TEMPERATURE | Liquidus: 183°C/3613°F Max: 230°C/446°F |
SDS | Link |
SPEC. SHEET | Link |
Water Soluble Sn63-Pb37, Type 4
SOLDER PASTE PRODUCT NUMBERS | 88-14-8950 (Jars, Cartridges, Squeezers) 88-14-86 (Syringes) |
FLUX TYPE | Water Soluble |
SOLDER ALLOY | 63Sn/37Pb |
ALLY MESH SIZE | Type 4 |
METAL CONTENT | 89.50% (Jars, Cartridges, Squeezers) 86% (Syringes) |
SPECIFICATIONS | ROL0 per IPC J-STD 004 |
REFLOW TEMPERATURE | Liquidus: 183°C/3613°F Max: 230°C/446°F |
SDS | Link |
SPEC. SHEET | Link |
Water Soluble Sn63-Pb37, Type 5
SOLDER PASTE PRODUCT NUMBERS | 88-15-8950 (Jars, Cartridges, Squeezers) |
FLUX TYPE | Water Soluble |
SOLDER ALLOY | 63Sn/37Pb |
ALLOY MESH SIZE | Type 5 |
METAL CONTENT | 88.50% (Jars, Cartridges, Squeezers) |
SPECIFICATIONS | ROL0 per IPC J-STD 004 |
REFLOW TEMPERATURE | Liquidus: 183°C/3613°F Max: 230°C/446°F |
SDS | Coming Soon |
SPEC. SHEET | Coming Soon |