SSF-NC50
| Superior Flux Number | SSF-NC50 |
| Description | No-Clean, VOC-free, selective soldering flux |
| Rec. Solders | Lead-Free or Lead-Bearing |
| Rec. Temp Ranges | 200-350°C / 390-660°F |
| Specs. | IPC ANSI-J-STD ORL0 |
| SDS | Link |
| Spec. Sheet | Link |
SSF-NC400
| Superior Flux Number | SSF-NC400 |
| Description | No-clean, alcohol-based, selective soldering flux |
| Rec. Solders | Lead-Free, Tin/Lead |
| Rec. Temp Ranges | 200-350°C / 390-660°F |
| Specs. | IPC ANSI-J-STD ROL1 |
| SDS | Link |
| Spec. Sheet | Link |
SSF-WS80
| Superior Flux Number | SSF-WS80 |
| Description | Water-Soluble, Neutral, Alcohol-Based, Selective Soldering Flux |
| Rec. Solders | Lead-Free, Tin/Lead |
| Rec. Temp Ranges | 200-350°C / 390-660°F |
| Specs. | IPC ANSI-J-STD ORM1 |
| SDS | Link |
| Spec. Sheet | Link |
SSF-RMA20
| Superior Flux Number | SSF-RMA20 |
| Description | Rosin-Based, Type RMA, Selective Soldering Flux |
| Rec. Solders | Lead-Free, Tin/Lead |
| Rec. Temp Ranges | 200-350°C / 390-660°F |
| Specs. | IPC ANSI-J-STD ORM1 MIL-F-14256, Type RMA |
| SDS | Link |
| Spec. Sheet | Link |
No. 75
| Superior Flux Number | No. 75 |
| Description | Selective Soldering Solder Nozzle Tinning Flux – Contains Ammonium Chloride |
| Rec. Solders | Lead-Free, Tin/Lead, Fusible Alloys |
| Rec. Base Metals | Copper, Brass, Nickel, Alloy 42, Stainless Steel |
| Rec. Temp Ranges | 95-350°C / 200-660°F |
| Specs. | IPC ANSI-J-STD INH1 |
| SDS | Link |
| Spec. Sheet | Link |
No. 23
| Superior Flux Number | No. 23 |
| Description | Selective Soldering Solder Nozzle Tinning Flux – Contains NO Ammonium Chloride |
| Rec. Base Metals | Copper, brass, nickel, alloys 42 & 51, Kovar, some ferrous metals. |
| Rec. Solders | Lead-Free, Tin/Lead, Fusible Alloys |
| Rec. Temp Ranges | 95-350°C / 200-660°F |
| Specs. | IPC ANSI-J-STD INH1 |
| SDS | Link |
| Spec. Sheet | Link |
No. 515
| Superior Flux Number | No. 515 |
| Description | Selective Soldering Solder Nozzle Tinning Flux – Chloride-Free |
| Rec. Base Metals | Copper, brass, nickel, alloys 42 & 51, Kovar, some ferrous metals. |
| Rec. Solders | Lead-Free, Tin/Lead, Fusible Alloys |
| Rec. Temp Ranges | 95-350°C / 200-660°F |
| Specs. | IPC ANSI-J-STD INH1 |
| SDS | Link |
| Spec. Sheet | Link |
Superior selective soldering fluxes are RoHS compliant. Please see SDS for details on shipping or Contact Us.
Selective Soldering Fluxes
Superior SSF-NC50 is a VOC-free, No-Clean flux that promotes the rapid activity necessary for selective soldering. SSF-NC50 is also formulated to withstand the higher temperature requirements of selective soldering applications. SSF-NC50 leaves a clear residue and is effective for both lead-free and lead-bearing solder alloys. SSF-NC50 is classified as an ORL0 per J-STD-004.
Superior SSF-NC400 is an alcohol-based, No-Clean flux that contains a specialized rosin/resin blend that leaves a clear residue and is effective for both lead-free and lead-bearing solder alloys. This No-Clean flux’s activity level is robust to meet the rapid activity, leaving a bright solder finish and no visible residue. SSF-NC400 is classified as an ROL1 per J-STD-004.
Superior SSF-WS80 water-soluble flux is a neutral, alcohol-based flux ideally formulated for selective soldering applications. SSF-WS80 provides the activity of a water-soluble flux, but as it is neutral, it should not corrode the stainless steel components of the equipment. SSF-WS80 is classified as an ORM0 per J-STD-004.
Superior SSF-RMA20 is a Type RMA rosin flux formulated for selective soldering applications. SSF-RMA20 has the controlled activity of an RMA flux, but contains the ideal amount of solvents to reduce the clogging of the flux sprayer nozzle typical with rosin-based fluxes. (Note: The clogging of flux spray nozzles with rosin residue can often by cleared up by flushing the flux spray apparatus with Isopropyl Alcohol 99%.) This rosin flux conforms to Mil-F-14256, Type RMA, and ROM1 per J-STD-004
Nozzle Tinning
Superior No. 75 is a conditioning flux specifically formulated for tinning the soldering nozzle on selective soldering machines. Regular and proper tinning of the top and side of the solder nozzle barrel ensures the solder will flow evenly and consistently out of the nozzle. When not regularly tinned, there is an increased likelihood that the solder will begin to flow unevenly, leading to inconsistent or ineffective soldering of the PCB. No. 75 contains Zinc Chloride and Ammonium Chloride.
Superior No. 23, like the No. 75, is a conditioning flux formulated for tinning soldering nozzles. Unlike the No. 75, No. 23 does not contain any Ammonium Chloride, a chemical that may be regulated in certain countries.
Superior No. 515 is a soldering nozzle conditioning flux that contains no Chlorides. Instead of Chlorides, the No. 515 is based on a Hydrobromic Acid activation system. This flux is active, cleaning off the oxides and residues from the soldering nozzle, but since it does not contain Chlorides, it leaves a cleaner residue than fluxes that do contain Chlorides.