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Aluminum Soldering Flux
Superior Flux offers the widest range of aluminum soldering fluxes on the market, including fluxes for soldering aluminum-to-aluminum, aluminum-to-copper, aluminum-to –brass and aluminum-to-plated terminals.
Please see the Video Links for aluminum soldering applications.
Please review the following papers on aluminum soldering: Direct Aluminum Solder Paste (IMAP Thermal Management Workshop – Palo Alto, CA, 2011) Soldering Aluminum (SME International Brazing & Soldering Conference – Orlando, FL, 2009)
Superior No. 1260 is a general purpose aluminum soldering flux that has a honey-like consistency and color. It is high activity, organic based and chloride-free. Formulated for soldering Aluminum-to-Aluminum, Aluminum-to-Copper, Aluminum-to-Brass, and Aluminum-to-plated terminals. Post-solder residues are water-soluble and should be cleaned post soldering. Superior No. 1260 can also be utilized in joining Aluminum to difficult-to-solder metals like stainless steel, kovar or nickel.
Superior No. 1261 Aluminum Tinning Flux offers the effectiveness of No. 1260 in a liquid form. It is ideal for tinning and soldering of aluminum wires, cable connectors and for dip soldering aluminum magnet wire. Post-solder residues are water-soluble and should be cleaned post soldering.
Superior No. 1265 Aluminum Paste Flux was formulated for applications where the adhesiveness of a paste form is required. No. 1265 can be precision dispensed and spread. Once applied, the Aluminum Paste Flux adheres to the desired location without spreading or dripping. Post-solder residues are water-soluble and should be cleaned post soldering.
Superior No. 1280 is a viscous high temperature aluminum soldering flux formulated for Zinc-Aluminum solder alloys that can be used in torch soldering applications. No. 1280 is used for soldering aluminum to aluminum, copper, brass, and plated terminals. No. 1280 can also be utilized in joining aluminum to difficult-to-solder metals like stainless steel, nickel and kovar. Post-solder residues are water-soluble and should be cleaned post soldering. In applications where water can not be used, methyl or isopropyl alcohols can be used to remove post-solder residues.