Superior No. 30 SuperSafe Soldering Flux and its variations represent our most popular soldering flux. Safer to use than most fluxes, No. 30 is ideal for a variety of electronic soldering applications, as well as electrical, industrial, artisan and aerospace applications.
Superior No. 30 and its variations ship as “non-hazardous” and are RoHS compliant.
Superior No. 30 SuperSafe Soldering Flux – Liquid
The Superior No. 30 family of fluxes is ideal for all-purpose soldering in electronics as well as general purpose soldering. No. 30 Soldering Flux is used with printed circuit boards (PCB’s); semi-conductor and component lead tinning; flat and round wire fabrication; wire, cable and terminal lead tinning and soldering applications. Learn about our full range of Electronics Soldering Flux. In addition to these electronics soldering applications, Superior No. 30 soldering flux is also used in a variety of industrial and artisan applications. (Learn about our extensive range of Industrial Soldering Flux and Aluminum Soldering Flux.)
Superior No. 30 is a water-based, organic acid (OA) flux with fully water-soluble post-solder residues. The OA Amino Acid/Halide activator begins oxide removal at room temperature making it an excellent choice for Lead-Free, Tin/Lead, and Fusible alloys. All post-solder residues are water-soluble and should be cleaned off in 60°/140°F water to avoid cleanliness failures.
Superior No. 30DS – Double-Strength Liquid Flux
Superior No. 30DS is the double strength version of No. 30. It exhibits more lasting power that No. 30 during soldering applications. No. 30DS is an ideal choice for high production rates or difficult metal surface conditions where an active, but safe soldering flux is required. Post-solder flux residues should be cleaned off in 60°/140°F water to avoid post-solder contamination of soldered or tinned component.
Superior No. 30 Paste Flux
No. 30 Paste is an ideal solder flux when the adhesiveness of a paste form is advantageous. Post-solder flux residues should be cleaned off in 60°/140°F water to avoid post-solder contamination of soldered or tinned component.